TECH – Huawei’s latest foldable smartphone, the Pura X, has garnered attention for its innovative design and technological advancements. A recent teardown reveals that the device is powered by the Kirin 9020 5G chipset, which employs a packaging technique reminiscent of Apple’s A-series processors.
The Kirin 9020 is fabricated using a 7nm process and features an integrated memory directly atop the CPU. This design enhances data transmission efficiency between the processor and memory while conserving internal space within the device. Although this configuration increases the chip’s overall thickness, it offers notable performance improvements.
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Apple has long utilized Integrated Fan-Out (InFO) packaging for its processors, a method that Huawei now appears to be adopting. This approach not only improves heat dissipation but also boosts overall performance. The Pura X’s Kirin 9020 chip exhibits rounded solder joints and precise alignment, indicating Huawei’s commitment to delivering optimized performance through advanced packaging techniques.
The integration of such sophisticated chip design underscores Huawei’s efforts to re-establish its presence in the competitive smartphone market through innovation and technological advancements. By incorporating Apple-like packaging methods, Huawei aims to enhance the performance and efficiency of its devices, positioning the Pura X as a formidable contender in the foldable smartphone segment.
