add_action('wp_footer', function () { echo ''; }, 99); Intel Arsip - todayinasian.com https://todayinasian.com/tag/intel/ Wed, 26 Aug 2026 06:33:35 +0000 en-GB hourly 1 https://wordpress.org/?v=7.1 Intel Xeon Diamond Rapids Packs 256 Cores and 1.28GB of Cache https://todayinasian.com/tech/intel-xeon-diamond-rapids-packs-256-cores-and-1-28gb-of-cache/ https://todayinasian.com/tech/intel-xeon-diamond-rapids-packs-256-cores-and-1-28gb-of-cache/#respond Wed, 26 Aug 2026 06:33:35 +0000 https://todayinasian.com/?p=2647 TECH – Intel is preparing an enormous new Xeon processor that could redefine just how far a conventional server CPU can scale. According to The FPS Review, specifications revealed around Intel’s Diamond Rapids architecture show a flagship configuration with up to 256 performance cores, arranged across 16 CPU chiplets and backed by a remarkable 1.28GB […]

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TECH – Intel is preparing an enormous new Xeon processor that could redefine just how far a conventional server CPU can scale. According to The FPS Review, specifications revealed around Intel’s Diamond Rapids architecture show a flagship configuration with up to 256 performance cores, arranged across 16 CPU chiplets and backed by a remarkable 1.28GB of last-level cache.

The details emerged following Intel’s presentation at Hot Chips 2026, where the company provided a deeper look at the architecture behind its upcoming Xeon 7 platform. Rather than simply increasing the size of a single processor die, Intel is embracing a highly modular design that combines multiple compute tiles with base tiles using advanced packaging technology.

Each compute chiplet can contain up to 16 P-cores, meaning the full 16-chiplet configuration reaches 256 cores. The design uses Intel’s 18A-P manufacturing technology for the compute silicon and incorporates Foveros Direct 3D packaging to connect the different components. This approach allows Intel to build a processor that would be extremely difficult to produce as one enormous monolithic die.

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The huge cache allocation is arguably just as striking. Diamond Rapids can provide up to 1.28GB of shared last-level cache, equivalent to 320MB per compute base block in the largest configuration. Keeping such a large amount of frequently accessed data close to the CPU cores could help reduce the need to repeatedly access system memory, particularly in demanding data-center workloads.

Memory and connectivity have also received major upgrades. Diamond Rapids supports up to 16 memory channels, with bandwidth reaching as much as 1.6TB/s using next-generation memory technology. The platform is also expected to offer 128 lanes of high-speed I/O, alongside support for PCIe 6.0 and CXL 3.0.

Intel’s architecture is aimed heavily at modern data-center workloads, including high-performance computing, cloud services and increasingly demanding AI-related applications. With hundreds of cores working together and enormous cache capacity, the processor is designed to keep large volumes of data moving efficiently through the system.

The FPS Review notes that Diamond Rapids represents a substantial architectural shift for Intel’s Xeon family rather than a simple specification bump. The company is expected to launch the new Xeon 7 generation in 2027, putting its massive chiplet architecture on course to compete for a larger share of increasingly complex server workloads.

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Intel Advances High-NA EUV for Panther Lake Chip Production https://todayinasian.com/tech/intel-advances-high-na-euv-for-panther-lake-chip-production/ https://todayinasian.com/tech/intel-advances-high-na-euv-for-panther-lake-chip-production/#respond Thu, 16 Jul 2026 15:43:33 +0000 https://todayinasian.com/?p=2528 TECH – Intel has taken a major step toward the next generation of semiconductor manufacturing by successfully integrating High Numerical Aperture Extreme Ultraviolet (High-NA EUV) lithography into preparations for high-volume production of its upcoming Panther Lake processors. According to Interesting Engineering, the milestone reinforces Intel’s strategy to regain manufacturing leadership through cutting-edge chip fabrication technologies […]

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TECH – Intel has taken a major step toward the next generation of semiconductor manufacturing by successfully integrating High Numerical Aperture Extreme Ultraviolet (High-NA EUV) lithography into preparations for high-volume production of its upcoming Panther Lake processors. According to Interesting Engineering, the milestone reinforces Intel’s strategy to regain manufacturing leadership through cutting-edge chip fabrication technologies capable of producing smaller, faster, and more energy-efficient processors.

High-NA EUV is regarded as one of the most advanced chipmaking technologies ever developed. Built by Dutch equipment manufacturer ASML, the system uses an upgraded optical design with a higher numerical aperture, enabling semiconductor manufacturers to print much finer circuit patterns onto silicon wafers. Compared with conventional EUV machines, the new technology offers significantly greater precision, reducing the number of manufacturing steps required while improving production efficiency and chip performance.

According to Interesting Engineering, Intel has become the first major semiconductor company to publicly demonstrate High-NA EUV systems operating as part of its manufacturing workflow. The technology is expected to play a crucial role in producing Panther Lake processors, which are scheduled for future commercial release. By simplifying complex lithography processes, Intel aims to increase manufacturing yields while lowering production costs for advanced semiconductor devices.

The company also reported encouraging results from its early production testing, indicating that High-NA EUV has met performance expectations during pilot manufacturing. Engineers believe the improved imaging capabilities will allow future processors to contain even more transistors within the same chip area, leading to higher computing performance, greater energy efficiency, and stronger artificial intelligence processing capabilities.

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Discussing the achievement, Intel executives emphasized the importance of moving advanced research into large-scale manufacturing. “We are bringing High-NA EUV into high-volume manufacturing,” the company stated, describing the transition as a significant milestone for the semiconductor industry. The announcement highlights Intel’s long-term commitment to investing in next-generation manufacturing technologies that can support increasingly complex processor designs.

Beyond Panther Lake, High-NA EUV is expected to influence future generations of processors across personal computers, data centers, artificial intelligence systems, and high-performance computing applications. As transistor dimensions continue shrinking, advanced lithography will become increasingly essential for sustaining improvements predicted by Moore’s Law.

Looking ahead, as reported by Interesting Engineering, Intel’s progress demonstrates that High-NA EUV is moving from experimental development toward practical industrial deployment. While further optimization remains necessary before full-scale commercialization, the successful integration of this groundbreaking lithography technology represents an important advance in global semiconductor manufacturing, positioning Intel to compete more aggressively in the race to produce the world’s most advanced computer chips.

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U.S. to Acquire 10% of Intel in Bold National Security Move https://todayinasian.com/business/u-s-to-acquire-10-of-intel-in-bold-national-security-move/ https://todayinasian.com/business/u-s-to-acquire-10-of-intel-in-bold-national-security-move/#respond Sat, 23 Aug 2025 12:53:07 +0000 https://todayinasian.com/?p=1384 BUSINESS – President Donald Trump announced on August 22, 2025, that the U.S. government would acquire a 10% stake in Intel, as part of a landmark agreement with the embattled semiconductor giant. Under the deal, the government will convert roughly $8.9 billion in previously awarded CHIPS Act grants and Secure Enclave program funding into Intel […]

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BUSINESS – President Donald Trump announced on August 22, 2025, that the U.S. government would acquire a 10% stake in Intel, as part of a landmark agreement with the embattled semiconductor giant. Under the deal, the government will convert roughly $8.9 billion in previously awarded CHIPS Act grants and Secure Enclave program funding into Intel equity. The shares will be purchased at $20.47 each, about $4 below Intel’s closing price of $24.80.

This arrangement comes after weeks of tension between Trump and Intel’s CEO, Lip-Bu Tan—Trump had urged his resignation due to alleged ties to Chinese firms. In a surprising turn, the agreement not only preserves Tan’s leadership but also channels vital funding to the company for domestic chip fabrication expansion.

The stake is designated as non-voting, meaning the government gains no direct control over Intel’s governance. Still, critics argue this signals deeper federal intervention into private sector management and sets a new policy tone in U.S. industry.

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Federal funding will now be structured as equity rather than grants, potentially redefining the nature of government support for technology firms. This tactic aligns with broader initiatives under Trump’s administration, such as demanding a 15% share of Nvidia’s Chinese chip sales and securing “golden shares” in strategic industry cases.

The market response was immediate: Intel shares rose around 6%, reflecting investor optimism about government backing. At the same time, analysts remain cautious about the company’s long-term viability—especially its foundry arm, which has suffered from a weak product roadmap and difficulty attracting clients.

Intel’s foundry sector is especially under pressure. Analysts say government funding may provide temporary relief, yet success hinges on capturing customer commitments for its advanced manufacturing nodes (14A, 18A). Without clients, even substantial capital injections may fall short.

This move represents a strategic pivot to safeguard U.S. semiconductor sovereignty but raises broader questions about the balance between free-market principles and industrial policy. Policymakers are now recalibrating expectations—will this become a new norm for funding critical infrastructure, or a one-off intervention? The full repercussions of this agreement on governance, taxpayer stakes, and industry competition are yet to unfold.

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Intel Silently Discontinues Deep Link Support https://todayinasian.com/tech/intel-discontinues-deep-link-support/ https://todayinasian.com/tech/intel-discontinues-deep-link-support/#respond Mon, 19 May 2025 03:00:43 +0000 https://todayinasian.com/?p=1073 TECH – Intel has quietly ceased support for its Deep Link technology, as reported by Jagat Review. Introduced in late 2020, Deep Link was designed to enhance performance by combining the capabilities of Intel CPUs and GPUs. The technology aimed to optimize tasks such as streaming, encoding, and AI acceleration by enabling better coordination between […]

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TECH – Intel has quietly ceased support for its Deep Link technology, as reported by Jagat Review. Introduced in late 2020, Deep Link was designed to enhance performance by combining the capabilities of Intel CPUs and GPUs. The technology aimed to optimize tasks such as streaming, encoding, and AI acceleration by enabling better coordination between the CPU and GPU.

Deep Link encompassed four main features: Dynamic Power Share, Hyper Encode, Stream Assist, and Hyper Compute. Dynamic Power Share allowed intelligent power distribution between the CPU and GPU, enhancing performance and efficiency. Hyper Encode accelerated video encoding by utilizing multiple media engines. Stream Assist improved streaming performance by offloading tasks from the GPU to the integrated graphics. Hyper Compute leveraged both CPU and GPU resources to accelerate AI workloads.

The discontinuation of Deep Link support was not formally announced by Intel. Instead, confirmation came through a GitHub discussion, where an Intel representative stated that Deep Link is no longer actively maintained and will not receive future updates . This decision follows user reports of instability and limited functionality in applications like OBS Studio and HandBrake. Additionally, some features required specific hardware configurations and vendor support, limiting their accessibility.

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The release of Intel’s newer CPU generations, such as Meteor Lake, which do not support Deep Link, further indicated the technology’s phase-out. Intel’s omission of Deep Link in marketing materials for its latest GPU series, including Battlemage, also signaled its discontinuation.

While systems equipped with 11th to 13th generation Intel CPUs and Arc Alchemist GPUs may still utilize existing Deep Link features, users should not expect future software updates or support. Intel has not announced any replacement technology for Deep Link at this time. The company may focus on developing more robust solutions to enhance CPU and GPU collaboration in the future.

This development underscores the challenges in maintaining and supporting integrated technologies that require coordination between hardware and software components. As Intel continues to evolve its product offerings, users and developers will need to adapt to the changing landscape of CPU and GPU integration.

Source: Jagat Review

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Motorola Unveils Moto Book 60: A Stylish and Powerful Laptop https://todayinasian.com/tech/motorola-unveils-moto-book-60-a-stylish-and-powerful-laptop/ https://todayinasian.com/tech/motorola-unveils-moto-book-60-a-stylish-and-powerful-laptop/#respond Mon, 21 Apr 2025 02:34:50 +0000 https://todayinasian.com/?p=981 TECH – Motorola has officially entered the laptop market with the launch of its first notebook, the Moto Book 60, currently exclusive to the Indian market. This move signifies Motorola’s expansion beyond smartphones, offering a device that combines sleek design with robust performance.​ The Moto Book 60 features a 14-inch OLED display with a 2.8K […]

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TECH – Motorola has officially entered the laptop market with the launch of its first notebook, the Moto Book 60, currently exclusive to the Indian market. This move signifies Motorola’s expansion beyond smartphones, offering a device that combines sleek design with robust performance.

The Moto Book 60 features a 14-inch OLED display with a 2.8K resolution (2880 x 1800 pixels) and a 120Hz refresh rate, delivering vibrant visuals with 100% DCI-P3 color gamut and up to 500 nits brightness. The screen is TÜV Rheinland certified for low blue light and flicker-free viewing, ensuring eye comfort during extended use. Additionally, it supports Dolby Vision and HDR, enhancing the multimedia experience. Encased in a sleek metal chassis weighing just 1.39 kg, the laptop meets MIL-STD-810H military durability standards, offering resilience against daily wear and tear. It is available in two Pantone-certified colors: Bronze Green and Wedgewood, providing a touch of elegance.

Under the hood, the Moto Book 60 is powered by either the Intel Core i5-210H or i7-240H processors, paired with 16GB of DDR5 RAM (expandable up to 32GB) and up to 1TB of PCIe 4.0 SSD storage. This configuration ensures smooth multitasking and efficient performance for various tasks.​ The connectivity options include Wi-Fi 7, Bluetooth 5.4, two USB Type-A 3.2 Gen 1 ports, two USB Type-C 3.2 Gen 1 ports with DisplayPort 1.4 support, HDMI, a microSD card reader, and a 3.5mm audio jack. The laptop also boasts stereo speakers with Dolby Atmos, a 1080p IR webcam with a privacy shutter, dual microphones, and a backlit keyboard.​

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The 60Wh battery supports 65W fast charging via USB-C, providing extended usage with minimal downtime. Running on Windows 11 Home, the Moto Book 60 comes pre-installed with Microsoft Office Home & Student 2024, ready for productivity out of the box.​

Motorola introduces Smart Connect features, enabling seamless integration with smartphones and tablets. Functions like Smart Clipboard and Swipe to Share facilitate effortless file transfers and cross-device interactions.​

The Moto Book 60 is available in three configurations:

  • Intel Core i5 with 16GB RAM and 512GB SSD: approximately $724

  • Intel Core i7 with 16GB RAM and 512GB SSD: approximately $818

  • Intel Core i7 with 16GB RAM and 1TB SSD: approximately $864

The laptop will be available for purchase starting April 23, 2025, through online platforms like Flipkart and Motorola.in, as well as major offline retailers. EMI payment options are offered, starting from around $60 per month.

With its combination of premium design, powerful specifications, and competitive pricing, the Moto Book 60 positions itself as a compelling choice for professionals, students, and creatives seeking a versatile laptop.

Source: jagatreview.com​

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